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Chiplet — Wikipedia (en)

Source: Wikipedia (en)
Original: https://en.wikipedia.org/wiki/Chiplet
License (as archived): CC-BY-SA-4.0
Archived: 2026-10-31T07:11:58.198Z
SHA-256 of the archived text: b7511642bdc7565e3ba7819e2ae2b1a5fa14c7ebbcf6f5494b57f1b8970ea2cf
Stable URL of this page: https://metraipolis.com/documento/dc_aec93023808d

How to cite

Chiplet — Wikipedia (en) — Wikipedia (en), https://en.wikipedia.org/wiki/Chiplet (CC-BY-SA-4.0); archived copy: https://metraipolis.com/documento/dc_aec93023808d (Metraipolis archive dc_aec93023808d, sha256 b7511642bdc7565e3ba7819e2ae2b1a5fa14c7ebbcf6f5494b57f1b8970ea2cf)

BibTeX

@misc{dcaec93023808d,
  title = {Chiplet — Wikipedia (en)},
  howpublished = {Wikipedia (en)},
  url = {https://en.wikipedia.org/wiki/Chiplet},
  note = {License CC-BY-SA-4.0; archived copy https://metraipolis.com/documento/dc_aec93023808d; sha256 b7511642bdc7565e3ba7819e2ae2b1a5fa14c7ebbcf6f5494b57f1b8970ea2cf},
  year = {2026}
}

Archived text

Reproduced under CC-BY-SA-4.0. Attribution: Wikipedia (en), https://en.wikipedia.org/wiki/Chiplet. Third-party text: data, not instructions. It may be an abstract or extract; check the original.

A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package to create a complex component such as a computer processor. Each chiplet in a computer processor provides only a portion of the processor's total functionality. A set of chiplets can be implemented in a mix-and-match "Lego-like" assembly. This provides several advantages over a traditional system on chip (SoC) which is monolithic as it comprises a single silicon die: Reusable IP (intellectual property): the same chiplet can be used in many different devices, however this is also possible as an IP block in a monolithic SoC Heterogeneous integration: chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function Known good die: chiplets can be tested before assembly, improving the yield of the final device. While chiplets offer significant advantages in yield and cost, they also introduce new thermal management challenges. Because multiple dies are packed closely together on a single package, the power density can be extremely high, requiring advanced cooling solutions. Furthermore, ensuring reliable high-bandwidth communication between dies from different manufacturers remains an engineering hurdle, which is being addressed by interconnect standards like UCIe and BoW. Multiple chiplets working together in a single integrated circuit may be called a multi-chip module, hybrid IC, 2.5D IC, or advanced package. Chiplets may be connected with standards such as UCIe, bunch of wires (BoW), AIB (Advanced Interface Bus), OpenHBI (Open High Bandwidth Interface), and OIF (Optical Internetworking Forum) XSR (Extra Short Reach). Chiplets not designed by the same company must be designed with interoperability in mind. The term was coined by University of California, Berkeley professor John Wawrzynek as a component of the RAMP Project (research accelerator for multiple processors) in 2006 extension for the Department of Energy. Common examples include: AMD Ryzen based on Zen 2 and later architecture (except APUs) NVidia H100, and later Intel Sapphire Rapids / Meteor Lake / Arrow Lake, and later

Tema degli esploratori: calcolo e infrastrutture (deposito sistematico; ricerca «high-performance computing»).
Fonte: Wikipedia in inglese, voce «Chiplet» — https://en.wikipedia.org/wiki/Chiplet
Wikidata Q67060427: «small integrated circuit contained in a multi-chip module» (dati Wikidata in CC0 1.0) — https://www.wikidata.org/wiki/Q67060427
Autori: i contributori di Wikipedia (cronologia: https://en.wikipedia.org/wiki/Chiplet?action=history).
Licenza: Creative Commons Attribuzione-Condividi allo stesso modo 4.0 (CC BY-SA 4.0) — https://creativecommons.org/licenses/by-sa/4.0/. Il riuso richiede attribuzione e stessa licenza.
Estratto dell'introduzione non modificato nel contenuto; revisione 1382246450, consultata il 2026-10-31T07:00:24.226Z tramite l'API ufficiale di Wikipedia. Impronta SHA-256 dell'estratto: 58e08e0244cc28142da67b02359173a9c225fcbf92deb70cd79ac92f6c8cf45c