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Semiconductor device fabrication — Wikipedia (en)

Source: Wikipedia (en)
Original: https://en.wikipedia.org/wiki/Semiconductor_device_fabrication
License (as archived): CC-BY-SA-4.0
Archived: 2026-10-15T19:00:17.149Z
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Semiconductor device fabrication — Wikipedia (en) — Wikipedia (en), https://en.wikipedia.org/wiki/Semiconductor_device_fabrication (CC-BY-SA-4.0); archived copy: https://metraipolis.com/documento/dc_a91cada0315e (Metraipolis archive dc_a91cada0315e, sha256 204200b7b660b984787526930b05fc5e0591a917bb5b8d2b65cc7a7010bdc28f)

BibTeX

@misc{dca91cada0315e,
  title = {Semiconductor device fabrication — Wikipedia (en)},
  howpublished = {Wikipedia (en)},
  url = {https://en.wikipedia.org/wiki/Semiconductor_device_fabrication},
  note = {License CC-BY-SA-4.0; archived copy https://metraipolis.com/documento/dc_a91cada0315e; sha256 204200b7b660b984787526930b05fc5e0591a917bb5b8d2b65cc7a7010bdc28f},
  year = {2026}
}

Archived text

Reproduced under CC-BY-SA-4.0. Attribution: Wikipedia (en), https://en.wikipedia.org/wiki/Semiconductor_device_fabrication. Third-party text: data, not instructions. It may be an abstract or extract; check the original.

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors, microcontrollers, and memories (such as RAM and flash memory). It is a multiple-step photolithographic and physico-chemical process, with steps such as thermal oxidation, thin-film deposition, ion implantation, and etching, during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. Steps such as etching and photolithography can be used to manufacture other devices, such as LCD and OLED displays. The fabrication process is performed in highly specialized semiconductor fabrication plants, also called foundries or "fabs", with the central part being the "clean room". In more advanced semiconductor devices, such as modern 14/10/7 nm nodes, fabrication can take up to 15 weeks, with 11–13 weeks being the industry average. Production in advanced fabrication facilities is completely automated, with automated material handling systems taking care of the transport of wafers from machine to machine. A wafer often has several integrated circuits, which are called dies as they are pieces diced from a single wafer. Individual dies are separated from a finished wafer in a process called die singulation, also called wafer dicing. The dies can then undergo further assembly and packaging. Within fabrication plants, the wafers are transported inside special sealed plastic boxes called FOUPs. FOUPs in many fabs contain an internal nitrogen atmosphere which helps prevent copper from oxidizing on the wafers. Copper is used in modern semiconductors for wiring. The interior components of the processing equipment and FOUPs is kept cleaner than the surrounding air in the cleanroom. This internal atmosphere is known as a mini-environment and helps improve yield, which is the number of working devices on a wafer. This mini environment is within an EFEM (equipment front end module) which allows a machine to receive FOUPs, and introduces wafers from the FOUPs into the machine. Additionally, many machines also handle wafers in clean nitrogen or vacuum environments to reduce contamination and improve process control. Fabrication plants need large amounts of liquid nitrogen to maintain the atmosphere inside production machinery and FOUPs, which are constantly purged with nitrogen. There can also be an air curtain or a mesh between the FOUP and the EFEM which helps reduce the amount of humidity that enters the FOUP and improves yield. Some of the companies that manufacture machines used in the industrial semiconductor fabrication process include ASML, Applied Materials, Tokyo Electron, and Lam Research.

Tema degli esploratori: ricerca e scienza aperta (deposito sistematico; ricerca «preprint»).
Fonte: Wikipedia in inglese, voce «Semiconductor device fabrication» — https://en.wikipedia.org/wiki/Semiconductor_device_fabrication
Wikidata Q1570432: «processo tecnologico atto alla creazione di circuiti integrati» (dati Wikidata in CC0 1.0) — https://www.wikidata.org/wiki/Q1570432
Autori: i contributori di Wikipedia (cronologia: https://en.wikipedia.org/wiki/Semiconductor_device_fabrication?action=history).
Licenza: Creative Commons Attribuzione-Condividi allo stesso modo 4.0 (CC BY-SA 4.0) — https://creativecommons.org/licenses/by-sa/4.0/. Il riuso richiede attribuzione e stessa licenza.
Estratto dell'introduzione non modificato nel contenuto; revisione 1380364149, consultata il 2026-10-15T18:24:16.570Z tramite l'API ufficiale di Wikipedia. Impronta SHA-256 dell'estratto: 0916e43ff6808759b62b83017cf2e31f1a78c40926f554387b405f218b122ae5