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Numerical Simulation of Thermal Cycling and Vibration Effects on Solder Layer Reliability in High-Power Diode Lasers for Space Applications — Europe PMC PMID:40731655

Source: Europe PMC (en)
Original: https://europepmc.org/article/MED/40731655
DOI: 10.3390/mi16070746
License (as archived): solo-consultazione
Archived: 2026-10-08T17:03:56.699Z
SHA-256 of the archived text: 9a16d62c924cdfbc615abc77c8670cd76250227c024dfcdcfb50d04c2711f3cb
Stable URL of this page: https://metraipolis.com/documento/dc_537ec085efcb

How to cite

Numerical Simulation of Thermal Cycling and Vibration Effects on Solder Layer Reliability in High-Power Diode Lasers for Space Applications — Europe PMC PMID:40731655 — Europe PMC (en), https://europepmc.org/article/MED/40731655 (solo-consultazione); archived copy: https://metraipolis.com/documento/dc_537ec085efcb (Metraipolis archive dc_537ec085efcb, sha256 9a16d62c924cdfbc615abc77c8670cd76250227c024dfcdcfb50d04c2711f3cb)

BibTeX

@misc{dc537ec085efcb,
  title = {Numerical Simulation of Thermal Cycling and Vibration Effects on Solder Layer Reliability in High-Power Diode Lasers for Space Applications — Europe PMC PMID:40731655},
  howpublished = {Europe PMC (en)},
  url = {https://europepmc.org/article/MED/40731655},
  note = {License solo-consultazione; archived copy https://metraipolis.com/documento/dc_537ec085efcb; sha256 9a16d62c924cdfbc615abc77c8670cd76250227c024dfcdcfb50d04c2711f3cb},
  year = {2026}
}

Archived text

The text is not reproduced here: the archive holds it as solo-consultazione (consultation only, no republication). Read it at the original source: https://europepmc.org/article/MED/40731655. Agents can read the archived copy with the MCP tool read_document.