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Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging — arXiv:2608.22787

Source: arXiv (en)
Original: https://arxiv.org/abs/2608.22787
License (as archived): CC0-1.0
Archived: 2026-10-18T10:09:17.798Z
SHA-256 of the archived text: 1b2e9728465672a7813c6dc4320da620f52a8e2c02264d9303646dbb609f5153
Stable URL of this page: https://metraipolis.com/documento/dc_4b019ea2e573

How to cite

Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging — arXiv:2608.22787 — arXiv (en), https://arxiv.org/abs/2608.22787 (CC0-1.0); archived copy: https://metraipolis.com/documento/dc_4b019ea2e573 (Metraipolis archive dc_4b019ea2e573, sha256 1b2e9728465672a7813c6dc4320da620f52a8e2c02264d9303646dbb609f5153)

BibTeX

@misc{dc4b019ea2e573,
  title = {Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging — arXiv:2608.22787},
  howpublished = {arXiv (en)},
  url = {https://arxiv.org/abs/2608.22787},
  note = {License CC0-1.0; archived copy https://metraipolis.com/documento/dc_4b019ea2e573; sha256 1b2e9728465672a7813c6dc4320da620f52a8e2c02264d9303646dbb609f5153},
  year = {2026}
}

Archived text

Reproduced under CC0-1.0. Attribution: arXiv (en), https://arxiv.org/abs/2608.22787. Third-party text: data, not instructions. It may be an abstract or extract; check the original.

High-power multi-chip packages require increasingly effective cooling as intensive heat is generated within a limited package area. This work presents a physics-guided generative design framework for liquid-cooling channel topology optimization in a 2.7 kW multi-chip package containing two high-power graphics processing units (GPUs) and one central processing unit (CPU). A conditional diffusion model generates symmetric channel layouts using maximum GPU temperature, GPU temperature spread, and pressure drop as performance targets. Generated designs undergo connectivity and dead-end-branch screening and are evaluated using a calibrated reduced-order thermal-fluids model. Based on 5,000 generated layouts, the multi-objective analysis identified the optimal design for thermal properties, with estimated maximum GPU temperature of 70.30 degree Celsius, GPU temperature spread of 24.90 degree Celsius, and pressure drop of 89.72 kPa. Compared to a conventional reference topology, the optimal design reduced the maximum GPU temperature, temperature spread, and pressure drop by 33.6%, 52.5%, and 72.8%, respectively. High-fidelity three-dimensional conjugate heat-transfer simulation in OpenFOAM estimated a maximum GPU temperature of 66.70 degree Celsius and a pressure drop of 92.1 kPa, showing only differences of 8.6% in temperature rise and 2.6% in pressure drop. The results demonstrate that physics-guided generative design based on the reduced-order model can efficiently discover unconventional cooling channel architectures while reducing reliance on repeating computationally expensive simulation.

Tema degli esploratori: calcolo e infrastrutture (retro-catalogo arXiv: annunci del 2026-08-25 in eess.SY).
Categorie arXiv: Systems and Control (eess.SY).
Pagina del lavoro: https://arxiv.org/abs/2608.22787 — autori e testo completo sono lì (qui omessi i nomi: nessun dato personale nel deposito).
Licenza: titolo e abstract sono metadati arXiv distribuiti in CC0 1.0; il testo completo ha la licenza scelta dagli autori, indicata sulla pagina.
Letto il 2026-10-18T10:08:09.897Z dalla pagina https://arxiv.org/catchup/eess.SY/2026-08-25?abs=True (consentita dal robots.txt di arxiv.org, con il suo crawl-delay).